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【英文标准名称】:Environmentaltesting-Part2-69:Tests-TestTe:Solderabilitytestingofelectroniccomponentsforsurfacemountingdevices(SMD)bythewettingbalancemethod
【原文标准名称】:环境测试.第2-69部分:试验.试验Te:用润湿称量法进行表面安装装置(SMD)的电子元件的可焊性测试
【标准号】:IEC60068-2-69-2007
【标准状态】:现行
【国别】:国际
【发布日期】:2007-05
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC91
【标准类型】:()
【标准水平】:()
【中文主题词】:元件;电气工程;电学;电子工程;电子设备;电子设备及元件;电工产品;环境测试;材料测试;方法;SMD;可焊性;可焊性测试;表面安装;表面安装装置;试验设备;测试;润湿称量法
【英文主题词】:Components;Electricalengineering;Electricity;Electronicengineering;Electronicequipment;Electronicequipmentandcomponents;Electrotechnicalproducts;Environmentaltesting;Expressionofresult;Materialstesting;Methods;Preparation;Pretreatment;Singledetermination;SMD;Solderbathmethod;Solderability;Solderabilitytesting;Surfacemounting;Surfacemountingdevices;Testequipment;Testing;Wettingbalances
【摘要】:ThispartofIEC60068outlinestestTe,solderbathwettingbalancemethodandsolderglobulewettingbalancemethod,applicableforsurfacemountingdevices.Thesemethodsdeterminequantitativelythesolderabilityofterminationsonsurfacemountingdevices.IEC60068-2-54isalsoavailableforsurfacemountingdevicesandshouldbeconsultedifapplicable.Theproceduresdescribethesolderbathwettingbalancemethodandthesolderglobulewettingbalancemethodandarebothapplicabletocomponentswithmetallicterminationsandmetallizedsolderpads.Thisstandardprovidesthestandardproceduresforsolderalloyscontaininglead(Pb)andforlead-freesolderalloys.
【中国标准分类号】:L04
【国际标准分类号】:19_040;31_190
【页数】:25P.;A4
【正文语种】:英语